Friday, March 29, 2024

Akoustis Receives First 5G Mobile BAW Filter Design Win from Tier-1 RF Component Company

Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced that it has received its first design win in 5G mobile from a leading multi-billion-dollar Tier-1 RF component company customer. The XBAW® filter is designed into a new multiplexer product that is expected to ship in the first half of calendar 2023 as part of a major chipset OEM reference design.

The filter solution leverages one of Akoustis’ new wafer-level-packages (WLP), developed and manufactured its Canandaigua, New York fab. The new XBAW® design is being used to address difficult coexistence issues between 5G mid bands and WiFi 6E 5 to 7 GHz bands. The customer is considering additional applications for XBAW® in future modules for 5G smartphones, tablets, wearables, and other mobile devices after the successful completion of this first solution. Akoustis began shipping pre-production chips against customer purchase orders for development, sampling and qualification during the quarter ending December 31, 2022.

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The new Akoustis filter solution is the first product to ship with the internally developed and manufactured WLP. In response to global supply chain challenges, Akoustis has been developing proprietary WLP technology in its New York facility for the past year and is rapidly growing its manufacturing capacity to target the 5G mobile device market with its XBAW® filter products.

Jeff Shealy, founder and CEO of Akoustis, stated, “This is a significant milestone in the commercialization of our XBAW® technology.” Mr. Shealy continued, “This is our first design win for the 5G mobile market that is planned to ramp production in the first half of CY2023, supporting selectivity demands in the 3 to 7GHz 5G/WiFi spectrum. Further, it is our first product that leverages our new proprietary wafer-level-package technology, which is significantly smaller than our current packages and superior in back-end manufacturing cost. This is the culmination of significant effort by our team and tremendous advancement of our technology over the past year.”

SOURCE: Globe Newswire

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