SkyWater Technology, the trusted technology realization partner, announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO John Sakamoto, Haddad will build and scale SkyWater’s advanced packaging business serving both the defense and commercial market sectors. He will be responsible for all aspects of SkyWater’s advanced packaging business including technology development, engineering, marketing and Florida fab operations. He will also focus on strengthening collaborations with the advanced packaging ecosystem, including government partners, technology centers and university programs.
According to Sakamoto, “Bassel will lead the charge in driving the growth trajectory of our advanced packaging business. His commercial sector experience will be pivotal in cultivating key new customers and partnerships to build a strong commercial manufacturing presence. Bassel’s proven track record at Intel, where he effectively managed large-scale business lines and engineering projects, highlights his ability to translate strategies into operational success. We are excited to see the positive impact of his leadership on our advanced packaging business.”
Also Read: BAE Systems Secures $440M Contract for More Bradley Fighting Vehicles
Haddad is a seasoned executive with a strong foundation in business strategy, P&L management and the execution of engineering projects and operations. He has deep expertise in silicon, platforms and systems across enterprise, edge compute and mobile markets, with a history of driving business growth. Previously, Haddad was at Intel since 2011, most recently as vice president and general manager of edge device & AI products, managing a multi-billion dollar P&L and leading innovations in edge AI and IoT. Earlier in his career, he held roles in platform architecture, silicon development, systems and software engineering, delivering leadership products to various end markets. Haddad holds a Bachelor’s and Master’s degree in electrical engineering from Technion – Israel Institute of Technology.
“As Moore’s Law is slowing down, 2.5D and 3D advanced packaging becomes the next frontier of semiconductor technology innovation. The unprecedented demand for computation in the AI era makes heterogeneous integration a pivotal capability fueling the next phase of semiconductor growth,” said Haddad. “SkyWater is uniquely positioned to be a leading domestic supplier of advanced packaging solutions, serving both defense and commercial customers. I am thrilled to join SkyWater and look forward to rapidly scaling the business through continued innovation and operational excellence, building upon the foundation the team has established.”
SOURCE: Businesswire