STMicroelectronics has announced the release of its VL53L9, an integrated direct Time-of-Flight (dToF) 3D LiDAR module that is able to provide high-performance sensing and AI-ready data for numerous applications ranging from robotics and industrial automation, to smart building, health care, and augmented and virtual reality. The single-module solution provides advanced features with compact dimensions and low cost, which makes it possible to implement complex edge AI applications based on low-compute microcontrollers. Offering an industry-leading 2,268 resolution zones (54×42), a 54°x42° field of view, and frame rates of up to 100 frames per second, the VL53L9 provides precise 3D depth mapping and accurate object detection from less than 5 cm up to 9 meters with up to 1% accuracy. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and metasurface optical elements, the module delivers detailed depth perception while maintaining efficiency and compactness.
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“VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “This launch reflects our strategy to move beyond standalone sensors and deliver integrated sensing systems that support real-world edge AI.” The module’s dual-scan flood illumination, integrated processing, dedicated power management, and calibration-free design further simplify deployment while enabling advanced edge AI use cases.
