The Kyocera Corporation has recently announced the commercialization of the first multilayer ceramic core substrate, enabling the fabrication of next-generation semiconductor packages incorporating such complex devices as xPUs and switch ASICs for increasingly complex AI-enabled data center architectures. The product is scheduled for demonstration at ECTC 2026 and incorporates Kyocera’s unique Fine Ceramic materials for enabling higher density wiring and enhanced rigidity needed to overcome current challenges associated with large scale semiconductor packages’ warping.
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While the need for higher speed and denser integration is increasing with the rise of use cases such as AI generative models and large language models, traditional organic substrates face the problems of warping and limitations of miniaturization. Kyocera’s approach with ceramic substrate helps reduce the problem of warping, allowing for thin substrates, better performance and durability, and allows implementing finer and three-dimensional wiring with multi-layered structure and via microfabrication. In addition to providing solutions to current engineering challenges, Kyocera’s product comes with simulation capabilities that enable efficient development process by designing thermal, electrical, and mechanical properties.
