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Kyocera Unveils Advanced Ceramic Core Substrate for AI Semiconductor Packaging

The Kyocera Corporation has recently announced the commercialization of the first multilayer ceramic core substrate, enabling the fabrication of next-generation semiconductor packages incorporating such...

KYOCERA’s New “HAPTIVITY® i” Revolutionizes Human-Machine Interface (HMI)

KYOCERA Corporation (President and CEO: Hideo Tanimoto) unveiled its HAPTIVITY® i human-machine interface (HMI) technology — a hybrid innovation combining its patented HAPTIVITY® touch...

Foxconn Interconnect Technology (FIT) and Hudson Sustainable Group Invests in Wireless Power Leader, Powermat Technologies and Forms Strategic Partnership

Powermat Technologies, Inc., the global leader in advanced wireless power technology, announced a significant investment as part of a US $25 million Series B...
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