Tageos, a global leader in RFID and BLE inlays, and Pragmatic Semiconductor, a pioneer in flexible semiconductor technology, announced the expansion of their long-term strategic partnership with the launch of Tageos’ latest product portfolio based on Pragmatic’s flexible and sustainable NFC Connect product line. The new Tageos EOS Lite and EOS Zero Lite lines deliver innovative antenna designs with slim, low-carbon footprints, supporting growing demand for item-level intelligence and new market opportunities to connect our physical and digital worlds.
The EOS-932 Zero Lite PR1301 is a cost-effective, sustainable paper-based NFC inlay designed for seamless integration into paper packaging and labels. It enables a wide variety of mass market applications such as consumer engagement and product authentication where sustainability, form factor, and digital connectivity are critical. Combining the ultra-thin Pragmatic NFC Connect chip with a paper-based inlay antenna supports smooth integration to enable high-volume manufacturing, cost-effective deployment, and improved paper recyclability across retail packaging and labels.
Developed at the Tageos Innovation Center of Excellence (ICoE), the new products harness the company’s expertise in sustainable RFID inlays and tags and are the first to feature Pragmatic’s NFC Connect PR1301 chip. With its ultra-thin, flexible design, the chip is imperceptible to the touch, allowing for discreet integration into curved surfaces, on packaging or within products, to unlock mass market item-level intelligence in areas traditionally constrained by cost, supply chain, and sustainability challenges.
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By enabling scalable digital product identity and consumer smartphone interaction, the new inlay supports emerging physical-digital integration, recycling in modern retail supply chains, and the digitization of the customer journey. Brands and retailers can now embed discreet NFC functionality into packaging without altering its appearance, reduce their overall carbon footprint, and transform products into powerful marketing channels for consumer engagement, product authentication, and brand protection.
“Our close collaboration with Pragmatic Semiconductor combines innovation with a clear vision for sustainability, enabling customers to deliver highly scalable, cost-effective, and truly sustainable NFC inlays for smart packaging applications,” said Matthieu Picon, CEO, Tageos. “The new and growing FlexIC-based product lines EOS Lite and EOS Zero Lite are yet another example of our path to success, opening new possibilities for brands to connect to their customers through their products and the consumer’s most personal device, the smartphone.”
“Bringing this innovation to market is an exciting deployment of our FlexIC technology. With Tageos, we are addressing the rapidly expanding opportunity to seamlessly integrate intelligence at item level and deliver sustainable, connected experiences at scale,” said David Moore, CEO, Pragmatic Semiconductor. “Together, we are shaping a new era of smarter packaging, enabling direct consumer engagement with virtually any item to prove authenticity, deepen trust, and unlock data-driven insights and transparency across the value chain.”
SOURCE: PRNewswire
