Monday, November 25, 2024

OMNIVISION Launches 12MP LED-Flicker-Free Sensor for Automotive Cameras

OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog and touch & display technology, debuted its OX12A10 12-megapixel (MP)-resolution CMOS image sensor with TheiaCel™ technology at AutoSens Europe 2024. The new sensor improves automotive safety by providing enhanced resolution and image quality, regardless of lighting conditions. The OX12A10 is ideal for high-performance front machine vision cameras for advanced driver assistance systems (ADAS) and autonomous driving (AD).

The 12MP OX12A10 is the highest-resolution sensor in OMNIVISION’s 2.1-micron (µm) TheiaCel™ product family, which also includes the 8MP OX08D10 and 5MP OX05D10 devices. TheiaCel™ harnesses the capabilities of next-generation lateral overflow integration capacitors (LOFIC) and OMNIVISION’s DCG™ high dynamic range (HDR) technology to eliminate LED flicker regardless of lighting conditions. OMNIVISION’s TheiaCel™ solution also achieves a wider dynamic range than earlier automotive HDR architectures.

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“OMNIVISION sensing solutions provide increased driving safety and autonomy, and our new OX12A10 brings all of the most important features together into a single device, including high resolution, excellent low-light performance, LED flicker mitigation (LFM), small size, power efficiency and best-in-class high-temperature performance,” said Dr. Paul Wu, head of automotive product marketing, OMNIVISION. “Initially launched to the market at AutoSens last year, our TheiaCel™ technology has attracted great interest, and we are excited to round out the product family with the first high-performance 12MP sensor for the automotive industry. Our 5MP and 8MP solutions are designed for mainstream passenger vehicles, while the OX12A10 is designed to meet next-generation ADAS and AD machine vision requirements.”

The OX12A10 has a 1/1.43-inch optical format and is the first image sensor to feature OMNIVISION’s a-CSP+™ package technology. At just 12450µm x 8100µm in size, it has a much more compact design than traditional ball grid array (BGA) packages.

SOURCE: Businesswire

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