ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation...
ROHM Semiconductor announced they have begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with equivalent...
ROHM Semiconductor announced the development of a next-generation Schottky barrier diode (SBD) designed to overcome the traditional VF/IR trade-off, providing high-reliability protection for a...
ROHM Semiconductor announced they have developed AI-equipped MCUs (AI MCUs) – ML63Q253x-NNNxx / ML63Q255x-NNNxx – that enable fault prediction and degradation forecasting using sensing data in a wide...
