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Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies

Cadence announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows,...

Cadence Unveils Industry’s Fastest HBM4 12.8Gbps Memory IP to Power Next-Gen AI and HPC Systems

Cadence announced the release of its cutting-edge HBM4 12.8Gbps memory IP system, setting a new benchmark for memory bandwidth in SoCs designed for next-generation...

AST SpaceMobile & Cadence Partner to Advance Space-Based Cellular Broadband

Cadence Design Systems, Inc. and AST SpaceMobile, Inc, the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones...

Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications

Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including...

Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins

Cadence Design Systems, Inc. announced the new Cadence® Palladium® Z3 Emulation and Protium™ X3 FPGA Prototyping systems, a revolutionary digital twin platform that builds on the success...
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