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Cadence and TSMC Partners to Deliver Certified Design Solutions and Silicon-Proven UALink IP

The global semiconductor landscape is witnessing an unparalleled transformation in its physical nature. In order to deliver the exponential gains in compute density that...

Rapidus and Cadence Partner to Advance System-on-Chip Engineering with Agentic AI Integration

Rapidus Corporation and computational software leader Cadence Design Systems, Inc. have announced a strategic collaboration designed to pioneer agentic artificial intelligence (AI) methodologies for...

Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA

Cadence announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy. Built on Cadence’s...

Cadence and Samsung Foundry Form Alliance for AI Infrastructure and Physical AI

Semiconductor companies have reached the stage where the physics laws governing their processes face resistance in meeting the growing needs of the current wave...

Cadence Partners with TSMC to Enhance The Future of AI Chip Design

These days in the semiconductor industry, the challenge of manufacturing the next generation chips for AI and HPC is no longer just about physical...
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