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Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications

Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including...

Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins

Cadence Design Systems, Inc. announced the new Cadence® Palladium® Z3 Emulation and Protium™ X3 FPGA Prototyping systems, a revolutionary digital twin platform that builds on the success...

Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications

Cadence Design Systems, Inc., expanded its Tensilica IP portfolio to address the increasing computational requirements associated with automotive sensor fusion applications. The new high-performance...

Cadence and Dassault Systèmes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems

Cadence Design Systems, Inc. and Dassault Systèmes, announced at 3DEXPERIENCE World that they have extended their ongoing strategic partnership by integrating the AI-driven Cadence...

Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF

Cadence Design Systems, Inc. announced it has collaborated with TSMC to integrate the new Cadence® Virtuoso® Studio into the TSMC N16 mmWave design reference flow and...
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