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Cadence Unveils Industry’s Fastest HBM4 12.8Gbps Memory IP to Power Next-Gen AI and HPC Systems

Cadence announced the release of its cutting-edge HBM4 12.8Gbps memory IP system, setting a new benchmark for memory bandwidth in SoCs designed for next-generation...

AST SpaceMobile & Cadence Partner to Advance Space-Based Cellular Broadband

Cadence Design Systems, Inc. and AST SpaceMobile, Inc, the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones...

Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications

Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including...

Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins

Cadence Design Systems, Inc. announced the new Cadence® Palladium® Z3 Emulation and Protium™ X3 FPGA Prototyping systems, a revolutionary digital twin platform that builds on the success...

Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications

Cadence Design Systems, Inc., expanded its Tensilica IP portfolio to address the increasing computational requirements associated with automotive sensor fusion applications. The new high-performance...
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