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Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach

Avicena is unveiling a modular interconnect platform with multi-Tbps/mm shoreline density based on its LightBundle™ microLED technology, supporting a wide range of die-to-die interfaces. Avicena,...

Avicena Demonstrates Ultra-Fast Microled-Array Based Interconnects for Chip-To-Chip Communications

Avicena, a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications...
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