Raytheon, an RTX business, has received a contract from the Air Force Research Laboratory to create a domestic production capability for thin film lithium niobate (TFLN) wafers, an important component of high-speed secure communications and sensing systems used in defense, AI, computing, data centers, and telecommunication applications. The initiative addresses growing supply risks, as global access to TFLN is currently dominated by foreign sources, by creating a secure U.S.-based alternative for both the defense industrial base and commercial markets. “Global access to TFLN has become increasingly constrained, with supply consolidation leaving U.S. companies vulnerable to international disruptions,” said Colin Whelan, president of Advanced Technology at Raytheon. “Through this effort, Raytheon will stand up an independent U.S. supplier of next‑generation TFLN, building an open, third-party source that can serve a broad range of defense and commercial customers.”
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Raytheon’s Advanced Technology team will support G&H in developing the manufacturing process using ion slicing, with production transitioning to G&H in early 2026. “Establishing G&H as a robust, domestic merchant supplier of thin film lithium niobate is essential for creating next-generation faster and more efficient photonic transmission and sensing systems,” said Dr. Stratos Kehayas, president, Photonics at G&H. “G&H’s vertically integrated crystal and wafer manufacturing capabilities enable the reliable transition of this technology into U.S.-based production, strengthening supply chain resilience for both defense and commercial applications.”