ROHM Semiconductor introduced a 100 V power MOSFET, the RS7P200BM, offering best-in-class “wide SOA” in a compact 5.0 mm × 6.0 mm package. The MOSFET is intended for “hot-swap” circuits in AI servers powered from 48 V supplies-a configuration increasingly deployed by data centers to support high-performance GPU workloads and generative-AI infrastructure.
Compared with previous designs, RS7P200BM features both an ultra-low on-resistance (R₍DS(on)₎ = 4.0 mΩ at V₍GS₎ = 10 V, ID = 50 A) and superior surge tolerance: SOA of 7.5 A at 10 ms and 25 A at 1 ms under 48 V. This will be highly important in safely handling inrush current and overload conditions without component failure during typical server module swaps or power-up sequences-and it does so while minimizing heat generation and increasing overall power-conversion efficiency.
ROHM has packed this capability into a smaller DFN5060-8S package, measuring 5.0 × 6.0 mm. This is slimmer than the 8.0 × 8.0 mm package of its 2025 predecessor. As a result, it allows for higher-density mounting on server power boards. It also makes power supply designs more compact and flexible.
The RS7P200BM began mass production in September 2025. It’s already available at major electronics distributors like DigiKey and Mouser.
Why This Matters – Trends in the Semiconductor Industry
Rising Demand from AI-driven Data Centers
AI infrastructure, like servers for large language models and deep learning, requires more power. It also needs to be reliable and energy-efficient. Data centers are using more efficient 48 V power systems to cut losses and cooling needs. This creates a need for power components. They must handle high currents, frequent hot swapping, and transient events. Reliability is key. ROHM’s RS7P200BM meets these needs and highlights a shift in the industry. Power-device makers are adapting to the specific requirements of AI workloads.
Innovation in Power Devices – Balancing SOA, Efficiency, Miniaturization
In most power MOSFETs, there is a tradeoff between wide SOA-tolerance to overloads, inrush currents, and hot-swap conditions-and low on-resistance to ensure low power loss during normal operation. ROHM is pushing the envelope by achieving both in a compact package: this allows more efficient, dense, and thermally manageable power designs. For the broader semiconductor industry, this illustrates how power-device innovation continues to be vital-even in an era where “smart chips” and high-end ICs often draw most attention.
Enabling Compact, High-Density Board Designs
The packaging size of components is becoming increasingly relevant as the sophistication and density of modern server boards, power modules, and electronics assemblies continue to increase. A smaller MOSFET footprint helps power-supply designers cut board real estate, simplify routing, and may consequently cut material costs. This could mean smaller, cheaper, and more efficient power modules for OEMs, system integrators, and hyperscale data-center operators.
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Beyond AI Servers, Applications Are Broadening
While the RS7P200BM is optimized for AI-server hot-swap circuits, ROHM points out that it is also well-suited for industrial power supplies, battery-protected systems, UPS, robotics (e.g., AGVs), and other 48V systems. This versatility means the part could find opportunities across many segments – from data centers to industrial automation – which broadens the addressable market.
Potential Business & Market Impacts
For Power-Device Manufacturers: ROHM’s release raises the bar. Competitors will have to accelerate their own innovations, not only in switching speed or gate-charge, but also in safe-operating-area robustness, thermal design, and package miniaturization in order to compete in the AI-server market.
For Server/Data-Center OEMs: Availability of high-SOA, compact MOSFET enables dense, efficient power supply designs that can be thermally managed more effectively. That can reduce cooling costs, improve reliability, and support modular server architectures.
Industrial & 48 V System Suppliers: Vendors building battery-backed systems, robotic drives, or industrial power supplies may adopt the RS7P200BM for higher reliability in surge or inrush conditions, reducing failures and maintenance costs.
Supply Chain & Distribution: With the addition of new MOSFETs such as RS7P200BM into volume production and through the distribution channels, this should make it easier for electronics manufacturers, including smaller firms and startups, to design and prototype high-density, high-efficiency power systems.
For Energy Efficiency & Sustainability: Lower on-resistance and efficient power conversion help reduce heat generation and cooling load. Moving forward, this could lower energy consumption in data centers as a major concern while the scale of AI infrastructure grows globally.
Challenges & Considerations
Thermal Management Still Critical: Even with low on-resistance and good SOA, designers must provide adequate thermal path (PCB layout, copper pours, heat sinks) in order to realize efficiency gains – especially under high current or hot-swap conditions.
Market Adoption & Ecosystem Readiness: Full benefit requires adjustment in system-level designers’ power-supply designs and validation of hot-swap reliability, possibly including board re-certifications. Change inertia in large OEMs slows down the rate of adoption.
Competing Technologies: Other alternative power-device technologies can have advantages with regard to other contexts: SiC MOSFETs for higher voltage, GaN switches for switching speed and efficiency. The relevance of RS7P200BM depends on the application domain: 48 V hot-swap versus high-voltage conversion versus switching power supplies.
Supply-Chain Volume & Availability: Meeting demand from AI-server makers, data centers, and industrial clients will require a steady supply of these MOSFETs, maintaining the quality and scaling up production.
Conclusion
The RS7P200BM MOSFET launched by ROHM marks a significant occasion in the semiconductor power-device segment, for it reflects how the recent espousal of AI servers and large-scale data centers is redefining underlying component needs. As workloads increase, power distribution and efficiency become central; innovations in MOSFET technology might just combine wide-SOA ruggedness, low loss, and small form factor to drive a wave of next-generation power-supply designs. For the broader semiconductor industry, this reinforces the importance of power electronics as a foundational layer beneath the AI/compute boom. For companies-from device makers through system integrators to data-center operators-it presents an opportunity: to build more efficient, reliable, and scalable computing infrastructures.