Omnitron Sensors, the pioneer in MEMS fabrication IP for a new world of sensors, announced the appointment of Ijaz Jafri, Ph.D., as vice president of engineering. Dr. Jafri brings a 20+-year track record of successfully bringing disruptive MEMS and semiconductor technologies to market in the automotive, industrial, aerospace, defense and consumer sectors.
Technology and Managerial Leadership
In his new role, Dr. Jafri will oversee Omnitron’s engineering strategy, lead the company’s multidisciplinary development teams, and scale the transition from R&D to high-volume production. His appointment marks a significant milestone in Omnitron’s growth as it moves to commercialize its breakthrough sensor platform.
Omnitron Sensors Co-founder & CEO Eric Aguilar shared his enthusiasm in welcoming Dr. Jafri.
“We’re excited to welcome Ijaz to Omnitron at a pivotal time for the company,” said Mr. Aguilar. “His experience leading engineering at both startups and global enterprises — and bringing complex technologies from proof-of-concept to volume production — is exactly what we need as we scale. Ijaz’s track record across automotive, industrial and defense markets will be invaluable as we bring our novel semiconductor topology to market.”
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Before joining Omnitron, Dr. Jafri held senior leadership roles at Panasonic Corporation of North America, Qualtre Inc., Honeywell International, Corning, and GT Advanced Technologies. In these roles, he built and led global engineering teams, developed strategic product roadmaps, and established robust manufacturing and supply-chain systems in North America, Europe and Asia.
Dr. Jafri eagerly embraces his new leadership role at Omnitron Sensors.“Omnitron Sensors’ uniquely differentiated MEMS manufacturing technology — which delivers higher capacitance per unit area — has the potential to unlock entirely new product categories in cost-sensitive, high-volume markets,” said Ijaz Jafri, Ph.D., vice president of engineering at Omnitron Sensors. “I’m excited to join a team redefining what’s possible in sensor performance and manufacturability.”
SOURCE: Businesswire