Lam Research Corporation announced that its groundbreaking dry photoresist (dry resist) technology has been qualified for direct-print 28nm pitch back-end of line (BEOL) logic at 2nm and below by imec, a global leader in nanoelectronics research and innovation. This advanced patterning technique, developed by Lam Research, significantly enhances the resolution, productivity, and yield of extreme ultraviolet (EUV) lithography—a crucial technology in the manufacturing of next-generation semiconductor devices.
“Lam’s dry photoresist technology provides unparalleled low-defectivity, high-resolution patterning,” said Vahid Vahedi, Chief Technology and Sustainability Officer at Lam Research. “We are excited to offer this technology to imec and its partners as a critical process in the design and manufacturing of leading-edge semiconductor devices.”
As semiconductor manufacturers move towards increasingly advanced technology nodes, the need for smaller transistor features and reduced pitch sizes continues to grow. To meet the demands of next-generation device roadmaps, direct-print 28nm pitch BEOL is essential to enable further scaling. While smaller pitch sizes can typically result in poor pattern resolution, Lam’s dry resist technology overcomes this challenge by optimizing patterning and addressing the well-known tradeoff between EUV exposure dose (cost) and defectivity (yield).
Also Read: Renesas Unveils High-Performance MOSFETs
At imec, Lam’s 28nm pitch dry resist processes have been successfully paired with a low numerical aperture (NA) EUV scanner, with future scalability to a high NA EUV scanner. This pairing boosts EUV sensitivity and improves wafer pass resolution—thereby enhancing cost, performance, and yield. Furthermore, dry resist technology offers significant sustainability benefits, consuming less energy and using five to ten times fewer raw materials compared to traditional wet chemical resist processes. Lam’s dry resist technology also outperforms wet resist materials, achieving exceptionally low defectivity at a competitive cost.
“Through joint research and development, imec acts as a neutral partner for equipment manufacturers, demonstrating the feasibility of new materials and equipment, supporting process development, and providing integrated device manufacturers and foundries early access to innovative processes that accelerate their manufacturing roadmaps,” said Steven Scheer, Vice President of Process Technology at imec. “Lam’s dry resist achieves excellent defectivity and fidelity at competitive doses.”
Lam Research Corporation is a global leader in providing innovative wafer fabrication equipment and services to the semiconductor industry. Lam’s solutions enable customers to create smaller, more powerful devices. In fact, nearly every advanced chip today is built using Lam technology.