Friday, November 22, 2024

Ansys Receives 2021 TSMC OIP Partner of the Year Awards for Next-Generation Design Enablement

Ansys has been recognized by TSMC as a recipient of two 2021 OIP Partner of the Year awards for Joint Development of 4nm Design Infrastructure and Joint Development of 3DFabric™ Design Solution. The Partner of the Year award honors TSMC Open Innovation Platform® (OIP) ecosystem partners’ pursuit of excellence in next-generation design enablement over the past year. Ansys and other OIP ecosystem partners’ collaborative efforts effectively promote innovation in the semiconductor industry. TSMC announced award winners at its 2021 OIP Ecosystem Forum, a one-of-a-kind event that brings together the semiconductor design ecosystem partners and TSMC customers, providing an ideal platform to discuss the latest technologies and design solutions for HPC, mobile, automotive, and IoT applications.

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Ansys provides a broad range of multiphysics analysis tools that help address matters that have become increasingly central concerns for advanced semiconductor manufacturing. Traditional signoff analyses, like voltage drop and electromigration, become more acute at 3nm and N4 technologies as the number of transistors grows, the complexity increases, and ultra-low supply voltages lead to vanishing safety margins. Ansys secured an award in the category of Joint Development of 4nm Design Infrastructure for working closely with TSMC on these issues leading to the certification of Ansys RedHawk-SC™ and Ansys Totem™ for TSMC’s most advanced 3nm and N4 processes.

TSMC 3DFabric technologies provide the industry with a solution for greater integration density. Realizing the advantages of 3DFabric requires not only higher capacity analysis platforms but also the integration of new physics into the design process. Ansys earned an award in the category of Joint Development of 3DFabric™ Design Solution for Ansys RedHawk-SC Electrothermal™ development on for full chip-and-package thermal analysis.

“Congratulations to Ansys as the winner of the 2021 TSMC OIP Partner of the Year awards,” said Suk Lee, vice president of Design Infrastructure Management Division at TSMC. “Your continuous collaboration and effort make us able to be at the forefront of technology development.

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