YES ( Yield Engineering Systems, Inc. ), a leading manufacturer of process equipment for advanced semiconductor packaging, announced that SkyWater Technology has selected YES RapidCure polymer dielectric curing systems for its implementation of M-Series fan-out wafer level packaging (FOWLP) technology in partnership with Deca Technologies ‘Deca’.
Decreasing line widths and spacing in advanced packaging is driving the development of new polymeric materials that require low-temperature curing. The YES RapidCure tool, based on an exclusive license to the Deca-developed process, is a combination of direct thermal and UV exposure that significantly reduces process cycle time. RapidCure enables YES customers to reduce thermal budgets for organic and inorganic thin films used in semiconductor front-end, packaging and display applications. The RapidCure process consists of an ultraviolet (UV) pretreatment to provide preliminary cross-linking of the polymer, followed by a precisely controlled thermal cure. RapidCure provides a significant performance advantage over conventional curing for select polymers while delivering comparable or superior dielectric properties.
“SkyWater is the first domestic licensee of Deca’s M-Series and Adaptive Patterning solutions to support the reshoring of the semiconductor supply chain,” said Bassel Haddad , Senior Vice President and General Manager of Advanced Packaging at SkyWater. “We are pleased to be a major customer of YES’ RapidCure technology, which will be instrumental in reducing cycle times for curing processes, enabling SkyWater to offer faster prototyping services, improved reliability and higher throughput.”
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“We are very pleased to have been chosen by SkyWater to support the manufacturing ramp of their M-Series FOWLP technology,” said Rezwan Lateef , President of YES. “Deca RapidCure technology has been an important complementary addition to our curing and materials engineering capabilities enabling YES to address a broader variety of advanced packaging applications including low temperature polymer curing, fill bake, adhesive curing, low-K film degassing/curing, and a variety of novel fan-out processes. Today’s announcement is the realization of a vision where we can ultimately provide SkyWater and other leading advanced packaging customers with the broadest range of polymer curing technologies with lower CoO and improved reliability to enable next generation products.”
“We are excited that Rezwan and the YES team are bringing their robust RapidCure product to market for the semiconductor industry,” said Tim Olson , founder and CEO of Deca. “With the proven ability to fully cure industry-standard polyimide and PBO materials in less than 20 minutes, RapidCure represents an unprecedented advancement in cycle time reduction for the future of high-density heterogeneous integration. Deca created the RapidCure process as a component of the development of its M-Series FOWLP and FOPLP technology under the direction of our legendary Chairman, TJ Rodgers, founder and CEO of Cypress Semiconductor. RapidCure reduces the typical six-hour cure time by more than 10-fold to accelerate the development and production of the advanced chiplet-based devices of the future.”
SOURCE: PRNewswire