Sunday, April 28, 2024

Fibocom collaborates with STMicroelectronics to launch smart home solution at MWC Barcelona 2024

Fibocom, a leading global provider of wireless IoT (Internet of Things) solutions and wireless communication modules, announced its collaboration with STMicroelectronics, a global semiconductor leader serving customers across the full spectrum of electronics applications, to launch an industry-leading smart home solution leveraging Matter-enabled technologies, STM32WB55 and FG370. The solution provides centralized control of smart home devices across different protocols, allowing smart home devices to interact seamlessly.

In today’s smart home connectivity landscape, one of the most challenging issues is connecting devices from different manufacturers without protocol barriers and allowing these devices to communicate in the same “language” seamlessly. The Connectivity Standards Alliance, the organization that maintains and publishes the Zigbee and Matter standards, plays a crucial role in ensuring the interoperability of various smart home devices. Similarly, the deployment of 5G networks has popularized the adoption of 5G FWA devices for flexible, reliable and fast connectivity at home.

In collaboration with STMicroelectronics, Fibocom integrated the smart home solution into the 5G CPE in conjunction with ST’s STM32WB55 MCU and Fibocom’s FG370 5G module. The STM32WB55 supports Bluetooth/Thread/Zigbee technologies, which is crucial for linking smart home devices and ensuring interconnections between devices at the application level, providing flexible Bluetooth + Thread and Bluetooth + Zigbee approaches. By enabling the 5G communication of the CPE, the FG370 provides the ability to connect the STM32WB55 via a UART device, allowing the device to be commissioned on the CPE. The alignment has significantly enhanced and opened the imagination of future home automation and provided end users with a full range of benefits to control smart home devices in a 5G CPE without redundant configurations.

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“Focusing on semiconductor technology innovation, ST is committed to providing customers with high-quality IoT connectivity solutions. We are pleased to see ST’s STM32WB55 MCU integrated into Fibocom’s FG370 5G module, enabling our customers to build smart home ecosystems on 5G CPEs,” said Yin Yu , Head of Wireless MCU Product Marketing at STMicroelectronics.

“The Alliance is committed to facilitating the simplified, secure and transparent interconnection of all things, paving the way for a connected future. Thanks to the collaboration of STMicroelectronics and Fibocom, this goal is simplified with 5G fixed wireless access, said Chris LaPré, chief technology officer at the Connectivity Standards Alliance. By launching this Matter-enabled smart home solution, which uses the two companies’ integrated hardware design, they will soon bring this benefit to solution providers.

“Fibocom joined the Connectivity Standards Alliance as an adopting member last year, and we are committed to enabling and implementing superior home connectivity through highly compatible wireless module solutions. And we are pleased that the collaboration with STMicroelectronics and the Connectivity Standards Alliance will make it possible to scale and accommodate a large number of smart home devices seamlessly and efficiently, said Simon Tao , vice president of the MBB unit at Fibocom. In the future of smart home solutions, we believe 5G FWA devices will become the “central hub” for superior home connectivity, and we see enormous potential to augment FWA devices with Matter-enabled hardware solutions. In the future, the ecosystem partnership will strengthen the acceleration of the smart home solution in a unified platform.

SOURCE: PRNewswire

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