Vertiv, a global provider of critical digital infrastructure and continuity solutions, announced a significant expansion of the Vertiv™ liquid cooling product portfolio with the introduction of the Vertiv™ CoolPhase CDU liquid-to-refrigerant coolant distribution unit and Vertiv™ CoolChip Fluid Network in-rack manifold. These systems enable modular, cost-effective liquid cooling deployments in data centers that weren’t originally configured for liquid cooling, making it possible to deploy high-density computing for AI alongside traditional air-cooled racks. The new systems are available now in North America.
The Vertiv CoolChip family delivers much-needed flexibility to data centers and colocation providers and enables fast, modular growth to support the increasing demand for AI deployments. Along with these new systems, Vertiv has a full suite of global service offerings to support the deployment of liquid cooled infrastructure, ranging from solution design to installation to on-going lifecycle management.
The Vertiv CoolPhase CDU is a liquid-to-refrigerant coolant distribution unit that uniquely offers direct to chip liquid cooling support with refrigerant-based heat rejection, enabling it to easily retrofit into existing facilities and to deploy liquid cooling in direct-to-chip applications without a facility chilled water system.
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The system can be rapidly deployed without the need for complex chilled water loops. The system can distribute coolant directly to chips, rear-door heat exchangers or even other CDUs, with full control of different and elevated temperature settings, eliminating multiple heat exchange loops. Combined with Vertiv™ EconoPhase technology and variable speed pumps, the system delivers free-cooling and enhances overall data center efficiency. The system leverages teamwork system level control, dual or triple power supplies for high availability; remote temperature, humidity and leak detection sensors; and integrated controls that enable remote monitoring and management.
Vertiv™ CoolPhase CDU can be deployed standalone to support liquid cooling loads or combined as part of the Vertiv™ Liebert® DSE room-based air cooling system as a complete thermal chain to support a hybrid air and liquid cooled environment.
The Vertiv™ CoolChip Fluid Network in-rack manifold is mounted in the zero-U space of industry-standard racks to route fluid from the coolant distribution unit to the server. With multiple coupling sizes, top or bottom dripless quick connects, and various port quantity combinations, the Vertiv CoolChip Fluid Network is easily installed and can be tailored to any direct-to-chip liquid cooling application.
“The proliferation of AI can only happen with the support of advanced cooling technologies,” said John Niemann, senior vice president of the thermal business unit at Vertiv. “Vertiv’s new liquid-cooled solutions and services enable both new and existing data centers to seamlessly introduce liquid cooling, making AI deployments easier, faster and more cost-effective than traditional approaches.”
SOURCE: Businesswire