Friday, November 22, 2024

Renesas Launches First 3-nm Automotive Multi-Domain SoC

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, launched the new generation of automotive fusion system-on-chips (SoCs), serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single chip. Built using the latest 3-nanometer (nm) automotive process technology, the highly-anticipated R-Car X5H SoC, which is the first device in the R-Car X5 series, offers the highest level of integration and performance in the industry, allowing OEMs and Tier 1s to shift to centralized Electronic Control Units (ECUs) for streamlined development and future-proof system solutions. Renesas’ R-Car X5H is among the first in the industry to offer highly-integrated, secure processing solutions on a single chip for multiple automotive domains, thanks to its unique hardware-based isolation technology. Additionally, the new SoC offers the option to expand AI and graphics processing performance using chiplet technology.

As the highest performance device within the fifth-generation (Gen 5) R-Car Family, the R-Car X5H directly addresses the growing complexity of Software-Defined Vehicle (SDV) development. These challenges include optimizing compute performance, power consumption, cost, hardware and software integration – while ensuring vehicle safety. By tightly coupling application processing, real-time processing, GPU and AI compute, large display capabilities, and sensor connectivity on a single chip, these devices enable a new class of automated driving, IVI and gateway applications.

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The new SoC series enables AI acceleration of up to 400 TOPS with industry-leading TOPS/W performance, and GPU processing of up to 4 TFLOPS*¹. It incorporates a total of 32 Arm® Cortex®-A720AE CPU cores for application processing, delivering over 1,000K DMIPS performance; and six Arm Cortex-R52 dual lockstep CPU cores delivering over 60K DMIPS performance with support for ASIL D capabilities without external microcontrollers (MCUs). Manufactured using one of TSMC’s most advanced process nodes, the new SoC series achieves both top-end CPU performance and a 30-35 percent reduction in power consumption*² compared to devices designed for a 5-nm process node. These power-efficient features significantly lower overall system costs by eliminating the need for additional cooling solutions while also extending vehicle driving range.

Chiplet Extensions for Flexibility and Additional Performance

While the R-Car Gen 5 SoCs come with powerful native NPU and GPU processing engines, Renesas is offering customers the ability to scale up their performance through chiplet extensions. When combining a 400-TOPS on-chip NPU with an external NPU via a chiplet extension, for example,it’s possible to scale their AI processing performance by three to four times or more. For seamless chiplet integration, the R-Car X5H offers the standard UCle (Universal Chiplet Interconnect Express) die-to-die interconnect and APIs, facilitating interoperability with other components in a multi-die system, even if they are non-Renesas chips.

SOURCE: Businesswire

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