Infineon Technologies AG, a world leader in power systems and Internet of Things (IoT) semiconductors, revealed that it has become a part of the NVIDIA MGX™ AI Factory network. The objective is to reinvent power delivery in next-gen AI data centers via combining Infineon’s latest power management solutions with NVIDIA’s modular, open reference design framework tailored for the agentic AI age.
Thanks to this collaboration, brand new 800V DC MGX-ready power racks will allow current data centers to quickly boost their computing and power capacity without changing anything.
Efficiency in Converting Grid Power to Core Power for Large-Scale AI Models
With the rapid expansion of AI models into the exponential territory, the data center sector must deal with a unique problem of achieving optimal computing performance under strict physical, thermal, and electrical limitations. The emergence of an 800VDC power architecture is one such industry paradigm that leads to less loss in power delivery and improved space management as compared to the legacy setup.
Through Infineon’s power conversion portfolio across various applications, the company employs a broad range of semiconducting materials like Silicon (Si), Silicon Carbide (SiC), and Gallium Nitride (GaN) to ensure peak efficiency in converting grid power into core power.
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“As a member of NVIDIA’s ecosystem, Infineon is working with NVIDIA to redefine power delivery systems from the grid to the processor core, which is required for this next phase of AI innovation,” says Adam White, Division President Power & Sensor Systems at Infineon. “As AI models continue to grow in size and complexity, data centers must deliver dramatically more compute performance within the same physical, power, and cooling constraints. Combined with NVIDIA’s modular MGX architecture, Infineon’s power solutions significantly enhance energy-efficient power distribution across the entire data center power flow. We look forward to continuing our work with NVIDIA to bring more MGX-powered innovations to market.”
Advanced Semiconductor Integration for Power Conversion
By supporting the complete 800 VDC power flow down to intermediate bus and core voltages in systems based on NVIDIA MGX, Infineon helps operators reduce internal conversion stages and safely deliver DC power closer to the server rack.
Important Technological Features Involve:
Core Gallium Nitride (GaN): Thanks to GaN’s ability to operate at very high switching frequencies of up to 1 MHz, Infineon makes bus converters highly compact in size while providing best-in-class energy efficiency.
Silicon Carbide (SiC) Safety: With the help of its proprietary SiC JFET technology and control ICs, Infineon achieves effective safety and precision in hot-swap capabilities right within the native 800 V server board design.
Multi-Stage Step Down Process: Power management systems with excellent integration can perform voltage reduction from 800 V to 50 V or 12 V, or even to 6 V directly.
The solution makes it possible for hyperscaler and cloud companies to implement more dense and efficient liquid or air-cooled AI server clusters without a significant negative environmental impact.
