Tower Semiconductor and Scintil Photonics have announced the availability of the world’s first heterogeneously integrated Dense Wavelength Division Multiplexing (DWDM) laser sources for AI infrastructure, built using Scintil’s SHIP™ technology on Tower’s high-volume silicon photonics platform, enabling next-generation co-packaged optics for higher bandwidth density, lower power per bit and improved GPU utilization. The partnership delivers LEAF Light™, the industry’s first DWDM-optimized intelligent integrated laser source, and establishes a clear path from customer evaluation to high-volume hyperscale manufacturing.
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“The scale-up networking opportunity is about to increase significantly as these server interconnects move to multirack CPO. Scale-up networking will consume an increasing portion of AI Networking’s $200B 2030 market as the market moves towards optical architectures, reducing the constraints on beachhead and copper bandwidth limitations per GPU/XPU,” said Alan Weckel, Founder and Technology Analyst at 650 Group, LLC. “Manufacturing and foundry to vendor alignment is the key to unlocking the CPO market to ensure the reliability and volumes that Hyperscalers need to hit their AI goals.” “Next-generation AI infrastructure demands optical interconnects that deliver more bandwidth per fiber at lower power per bit,” said Matt Crowley, Chief Executive Officer of Scintil Photonics. “DWDM co-packaged optics meets that bar. LEAF Light™ brings the DWDM laser source technology; Tower’s SiPho platform brings the manufacturing scale. With SHIP™ now validated on Tower’s production lines, customers have a path from evaluation to millions of units per month.”