E Ink the originator, pioneer, and global commercial leader in electronic paper (ePaper) technology, announced its collaboration with Realtek Semiconductor to unveil the second-generation System-on-Panel (SoP) electronic shelf label (ESL) reference design.
This innovative solution simplifies ESL development, significantly reducing the barrier to entry. Under identical display areas, the new-generation design achieves approximately a 30% reduction in thin-film transistor (TFT) size and a 50% decrease in flexible printed circuit (FPC) dimensions. This enables streamlined ESLs with slimmer borders perfectly suited for diverse retail environments.
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The groundbreaking SoP technology integrates components directly onto ePaper, glass, or flexible substrates, combining integrated circuits, panels, and system design into a unified ePaper display solution. The second-generation SoP incorporates Realtek’s Bluetooth chipset using Chip-on-Glass (CoG) technology, creating the world’s first device embedding a Radio Frequency Integrated Circuit (RFIC) directly onto glass. This advancement minimizes material usage, reduces product size, simplifies manufacturing processes, and delivers a more efficient, environmentally sustainable display solution.
“Electronic shelf labels have replaced traditional paper labels, enhancing efficiency and reducing energy consumption for retailers,” said Johnson Lee, Chairman of E Ink. “Our commitment to advancing ePaper technology remains strong. Following positive feedback on our initial SoP prototypes, we continued innovating to deliver the next-generation design. Our new ESL solution promises improved operational efficiency for retailers and contributes toward carbon reduction efforts.”
SOURCE: GlobeNewswire