Schneider Electric, the leader in the digital transformation of energy management and automation, has accelerated its end-to-end AI-ready data center solutions with new announcements that address the urgent energy and sustainability challenges driven by high demand for AI systems.
The first part of the announcement is a new data center reference design, co-developed with NVIDIA, which will support liquid-cooled, high-density AI clusters of up to 132 kW per rack. Optimized for NVIDIA’s GB200 NVL72 and Blackwell chips, the design streamlines planning and deployment with proven, validated architectures, addressing the unique challenges of utilizing liquid cooling at-scale.
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Additionally, Schneider Electric has introduced its new Galaxy VXL uninterruptible power supply (UPS), the industry’s most compact, high-density UPS designed for AI, data center, and large-scale electrical workloads. Galaxy VXL UPS offers 52 per cent space savings compared with the industry average, and with a power density of up to 1042 kW/m², this scalable, 1.25 MW modular UPS is designed to deliver more efficient power in a smaller, high-density footprint.
Both innovations form part of Schneider Electric’s end-to-end, AI-ready data center solutions, which focus on three key areas including developing an energy strategy for the AI era; deploying advanced infrastructure; and sustainability consulting. They seek to benefit data center owners and operators as they deploy energy efficient, high-density infrastructure to support AI workloads as sustainably as possible.
“The energy and environmental impact of AI is growing at unprecedented pace, and it’s paramount we bend the energy curve downward by finding new ways to decarbonize data centers and the digital infrastructure,” said Pankaj Sharma, Executive Vice President, Data Centers & Networks at Schneider Electric. “At Schneider Electric, we are committed to pushing boundaries, setting new standards, and shaping the future of AI, whilst protecting the environment. This requires a strategic approach from the grid to the chip, to the chiller, and beyond.”
SOURCE: Businesswire