Tuesday, November 3, 2026
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Radian Extends Its Merchandising Planning and Analytics Capabilities with Hybrid AI

Radian, the pioneer of retail Hybrid Intelligence™, announced a major expansion of its Merchandising Planning Suite, which will deliver integrated capabilities across assortment, base...

Rocket Lab Announces Acquisition Iridium Communications

Iridium Communications Inc., a leading provider of global voice, data, aircraft surveillance, and positioning, navigation, and timing (PNT) satellite services, and Rocket Lab Corporation,...

Renesas Introduces Smallest Configurable GreenPAK IC in Ultra-Compact WLCSP and STQFN Packages

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP...

Cadence and TSMC Partners to Deliver Certified Design Solutions and Silicon-Proven UALink IP

The global semiconductor landscape is witnessing an unparalleled transformation in its physical nature. In order to deliver the exponential gains in compute density that...

Toshiba Launches 3300V SiC MOSFET Module to Improve Reliability of Industrial Equipment

Toshiba Electronic Devices & Storage Corporation has launched the IX800FXF2YMS4, a 3300V, 800A dual silicon carbide (SiC) MOSFET module designed to improve the reliability,...

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