Hyundai Mobis and Qualcomm Technologies, Inc. announced that the companies have signed a comprehensive agreement at CES 2026 to co-develop next generation solutions for...
Cadence Design Systems, a leading provider of electronic design automation (EDA) tools and semiconductor IP, announced a new partner ecosystem aimed at accelerating chiplet...
Databricks announced that Toyota Motor Corporation has adopted the Databricks Data Intelligence Platform to power vista, a unified data and AI hub designed to...
Nordic Semiconductor announced a comprehensive ultra-low-power Edge AI solution that brings on-device intelligence to even the smallest battery-powered IoT devices, combining energy efficiency with...
Garmin, announced an expansion of its automotive technology collaboration with the introduction of the Nexus automotive-grade High Performance Compute (HPC) platform. Powered by Qualcomm...
