Tuesday, January 13, 2026
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Semiconductor & Electronics

Teledyne HiRel Semiconductors Launches eMMC 5.1 Module

Teledyne HiRel Semiconductors is pleased to announce the release of their industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact...

Micron Unveils Portfolio of Industry-First SSDs to Power the AI Revolution

Micron Technology, develops innovative memory and storage solutions to address the data needs of the AI-driven data center with superior performance, capacity and energy...

Macronix Introduces Cutting-Edge Secure-Boot NOR Flash Memory

Macronix International, a leading integrated device manufacturer in the non-volatile memory (NVM) market, announced ArmorBoot MX76, a robust NOR flash memory combining in a...

GlobalFoundries Expands Partnership with Apple to Advance Wireless Connectivity and Power Management & U.S. Chip Manufacturing

GlobalFoundries announced it has entered into an agreement with Apple for a deeper collaboration that will advance semiconductor technologies and strengthen U.S. manufacturing. This partnership...

NEO Semiconductor Introduces Extreme High Bandwidth Memory (X-HBM) Architecture for AI Chips

NEO Semiconductor, a leading developer of breakthrough memory technologies, introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet...
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