Teledyne LeCroy, the worldwide leader in protocol test and measurement solutions, announced the support for IEEE 802.3ck based 100GbE four-level pulse amplitude modulation (PAM4)...
Apple announced M1 Ultra, the next giant leap for Apple silicon and the Mac®. Featuring UltraFusion™ — Apple’s innovative packaging architecture that interconnects the...
Hong Kong Science and Technology Parks Corporation (HKSTP) has partnered with global semiconductor leader Infineon Technologies Hong Kong Limited (Infineon) in a strategic co-incubation...
Synopsys, Inc. announced that the Synopsys OptoCompiler™ solution will enable designers to leverage the new GlobalFoundries (GF) silicon photonics platform. GF's next generation, widely...
Ansys announced it is collaborating with GF to deliver innovative, unique, and feature-rich solutions to solve some of the biggest challenges facing data centers
With...
