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Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications

Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including...

Transphorm Demonstrates a Bidirectional SuperGaN Power Supply with New Reference Design for E-Mobility and Energy/Industrial Markets

Transphorm, Inc., the global leader in robust GaN power semiconductors, announced the release of a new 300 W DC-to-DC GaN reference design for 2-...

Green Hills Software Delivers Industry’s Most Comprehensive Production-Focused Software-Defined Vehicle (SDV) Solutions for NXP’s Open S32 CoreRide Platform

Green Hills Software, the worldwide leader in embedded safety and security, announced its significant role in NXP Semiconductors' open S32 CoreRide platform, a new...

Smith Names Mike Mercado Chief Information Security Officer

Smith, a leading global distributor of electronic components and semiconductors, announces the appointment of Mike Mercado to the position of Chief Information Security Officer. In...

Smith Has Named Art Figueroa as the Company’s Chief Operating Officer

Smith, a leading global distributor of electronic components and semiconductors, announces the appointment of Art Figueroa to the position of Chief Operating Officer. In this...
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