Mobix Labs, Inc., a fabless semiconductor company developing disruptive next-generation connectivity technologies for 5G infrastructure, satellite communications, and defense industries, announced it has begun...
Mitsubishi Electric Corporation, announced the coming release of six new J3-Series power semiconductor modules for various electric vehicles (xEVs), featuring either a silicon carbide...
Enpro Inc., an industrial technology company, announced that Joe Bruderek has joined the company as Executive Vice President, Finance, and Enpro’s board has appointed...
Murata introduced the Type 2FR connectivity module. The solution is driven by NXP® Semiconductor's RW612 Wireless MCU with integrated Tri-radio and measures just 12mm x...
