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Mitsubishi Electric to Release J3-Series SiC and Si Power Module Samples

Mitsubishi Electric Corporation, announced the coming release of six new J3-Series power semiconductor modules for various electric vehicles (xEVs), featuring either a silicon carbide...

Enpro Inc. to Appoint Joseph F. Bruderek Jr. as Chief Financial Officer

Enpro Inc., an industrial technology company, announced that Joe Bruderek has joined the company as Executive Vice President, Finance, and Enpro’s board has appointed...

Murata Expands Matter-Compliant IoT Connectivity Portfolio

Murata introduced the Type 2FR connectivity module. The solution is driven by NXP® Semiconductor's RW612 Wireless MCU with integrated Tri-radio and measures just 12mm x...

NRS CORPORATION: Establishment of a New Logistics Site in Arizona, U.S.A.

NRS CORPORATION is pleased to announce the opening of a new comprehensive logistics site in the U.S. state of Arizona, which has grown to...

Morse Micro Wins Best Wi-Fi IoT Product at 2023 Wi-Fi NOW Awards

Morse Micro, a fast-growing fabless semiconductor company focused on Internet of Things (IoT) connectivity with its Wi-Fi HaLow technology, announced that it has won...
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