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Renesas Introduces Smallest Configurable GreenPAK IC in Ultra-Compact WLCSP and STQFN Packages

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP...

Cadence and TSMC Partners to Deliver Certified Design Solutions and Silicon-Proven UALink IP

The global semiconductor landscape is witnessing an unparalleled transformation in its physical nature. In order to deliver the exponential gains in compute density that...

Toshiba Launches 3300V SiC MOSFET Module to Improve Reliability of Industrial Equipment

Toshiba Electronic Devices & Storage Corporation has launched the IX800FXF2YMS4, a 3300V, 800A dual silicon carbide (SiC) MOSFET module designed to improve the reliability,...

Skyryse and BAE Systems Australia Collaborates to Advance Software-Defined Autonomous Aviation

Skyryse, developer of the universal flight operating system SkyOS™, has entered into a strategic partnership with defense and security contractor BAE Systems Australia to...

Stoneridge Appoints Uwe Brandenburg as Global VP of Engineering & Innovation

Stoneridge, a global leader of safe, intelligent and efficient electronic technologies for the commercial vehicle and off-highway equipment markets, announced the appointment of Uwe...
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