Avicena is unveiling a modular interconnect platform with multi-Tbps/mm shoreline density based on its LightBundle™ microLED technology, supporting a wide range of die-to-die interfaces. Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA. The chiplet interconnect extends ultra-high density die-to-die (D2D) connections up to… Continue reading Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach