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What are Fanless Heat Sinks and How Do they Work?

With the increasing demand for high-performance electronic devices, the challenge of managing heat dissipation has become a pressing concern. Traditional cooling methods often rely...

Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach

Avicena is unveiling a modular interconnect platform with multi-Tbps/mm shoreline density based on its LightBundle™ microLED technology, supporting a wide range of die-to-die interfaces. Avicena,...

CoreWeave Opens New Texas Data Center to Expand Access to High-Performance GPUs

The investment represents a milestone in CoreWeave's strategic expansion plan to meet the accelerating demand for premium computing power. CoreWeave, a specialized cloud provider of...

Hypertec Launches New CIARA Trident iC Series Immersion-Born Servers

Cutting-edge high-density sustainable solution for high-performance computing (HPC), cloud computing, machine learning (ML) and artificial intelligence (AI) Hypertec, an innovative global provider of sustainable technology...
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