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Die packaging
die packaging
Energy, Power and Sustainability
Samsung Foundry Certifies Ansys Thermal Integrity and Power Integrity Solutions for Its Multi-Die Packaging Technologies
News Desk
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June 29, 2023
Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems Ansys announces that Samsung...
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