Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems
Ansys announces that Samsung...
Ansys' collaboration with Samsung Foundry validates industry-leading power integrity solutions for next-generation 2nm process technology
Following close collaboration with Samsung Foundry, Ansys has achieved certification of Ansys RedHawk-SC...
OneSky Systems and Ansys are collaborating to progress autonomy in advanced air mobility (AAM) solutions. OneSky is providing its airspace expertise and technology integrated with...
Ansys collaborated with Rolls-Royce and Intel to reduce the simulation time of the thermo-mechanical model of Rolls-Royce's gas-turbine engine from more than 1,000 hours...
Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. has strengthened its collaboration with TSMC...