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Samsung Foundry Certifies Ansys Thermal Integrity and Power Integrity Solutions for Its Multi-Die Packaging Technologies

Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems Ansys announces that Samsung...

Ansys Power Integrity Signoff Solutions Certified for Samsung’s 2nm Silicon Process Technology

Ansys' collaboration with Samsung Foundry validates industry-leading power integrity solutions for next-generation 2nm process technology Following close collaboration with Samsung Foundry, Ansys has achieved certification of Ansys RedHawk-SC...

OneSky and Ansys Expand Autonomous, AI-Based Advanced Air Mobility Solutions

OneSky Systems and Ansys are collaborating to progress autonomy in advanced air mobility (AAM) solutions. OneSky is providing its airspace expertise and technology integrated with...

Rolls-Royce Rapidly Powers Sustainable Aviation with Ansys and Intel Technologies

Ansys collaborated with Rolls-Royce and Intel to reduce the simulation time of the thermo-mechanical model of Rolls-Royce's gas-turbine engine from more than 1,000 hours...

Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems

Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. has strengthened its collaboration with TSMC...
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