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Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions

Ansys has been recognized by TSMC as a recipient of four TSMC Open Innovation Platform Partner of the year awards for 2023. The OIP Partner...

Ansys Semiconductor Simulation Solutions Certified for UMC’s 3D Chip Technology

Ansys multiphysics solutions have been certified by global semiconductor foundry UMC to simulate its latest 3D-IC WoW stacked technology, which will improve the power, efficiency...

Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC’s Most Advanced 4nm RF FinFET Process

Keysight Technologies, Inc. and Ansys  announced a new reference design flow for TSMC N4P RF, the silicon foundry's most advanced 4 nanometer (nm) radio frequency (RF)...

Samsung Foundry Certifies Ansys Thermal Integrity and Power Integrity Solutions for Its Multi-Die Packaging Technologies

Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems Ansys announces that Samsung...

Ansys Power Integrity Signoff Solutions Certified for Samsung’s 2nm Silicon Process Technology

Ansys' collaboration with Samsung Foundry validates industry-leading power integrity solutions for next-generation 2nm process technology Following close collaboration with Samsung Foundry, Ansys has achieved certification of Ansys RedHawk-SC...
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