MiTAC Computing Technology announced its participation at Supercomputing 2025, where it will spotlight its theme “AI Cluster Power – Cool Fast Scale Faster” and demonstrate a next-generation portfolio of modular, scalable rack solutions engineered for high-density AI and HPC deployments. Collaborating with key industry leaders including AMD, Broadcom, CoolIT, Intel, KIOXIA, Micron, NVIDIA, Samsung, and Solidigm, MiTAC will showcase infrastructure spanning single-server configurations to fully integrated clusters, with a strong emphasis on liquid cooling and energy-efficient architectures. The company will feature its high-density 48U liquid-cooled MR1100 rack supporting 64 to 256 AMD Instinct™ MI355X GPUs, AMD EPYC™ 9005 CPUs, and AMD Pensando™ Pollara 400 AI NICs to deliver non-throttled performance across 400/800 Gb/s networks.
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MiTAC will also present its air-cooled 45U MR1100A AI rack, powered by AMD Instinct™ MI350X/MI325X GPUs and Broadcom’s Tomahawk 5 chipset for low-latency interconnects. The company will also showcase its OCP ORv3 liquid-cooled rack. This rack supports up to 14 multi-node servers. It features AMD EPYC™ 9005 processors and CoolIT thermal management for sustainable HPC. MiTAC shows its commitment to data centers. They help these centers scale faster, run cooler, and handle tougher AI workloads.