GlobalFoundries and Renesas Electronics Corporation announced an expanded multi-billion-dollar manufacturing collaboration designed to broaden Renesas’ access to GlobalFoundries’ differentiated process technologies while reinforcing resilient, secure semiconductor supply chains aligned with U.S. onshoring priorities. The partnership will support the rapidly growing requirements of automotive, industrial and IoT systems, where chips enable advanced driver assistance, battery management, secure connectivity and automation. Under the agreement, Renesas will leverage GlobalFoundries’ FDX™ (FD-SOI), BCD and feature-rich CMOS platforms with non-volatile memory, with initial tape-outs expected to begin in mid-2026 and manufacturing spanning the U.S., Germany, Singapore and GF’s partner operations in China, with potential future technology porting to Renesas’ Japanese fabs.
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“This partnership strengthens a proven relationship and underscores GF’s role as a trusted partner for essential semiconductor technologies,” said Tim Breen, CEO of GlobalFoundries. “The automotive landscape is changing fast. Semiconductors are now the foundation of innovation, powering advanced driver assistance, battery management and secure connectivity. These systems demand performance and efficiency under extreme conditions, and GF’s differentiated platforms are built for that. We’re focused on delivering what matters most: reliable supply and the technologies that enable the vehicles of tomorrow.” “This expanded partnership enables a stable, long-term supply of semiconductors while ensuring the highest quality and reliability for our products. These capabilities are essential as we deliver advanced solutions, with demand for electrification and connectivity – and the rapidly growing compute requirements driven by AI applications – accelerating worldwide,” said Hidetoshi Shibata, CEO of Renesas.