Thursday, February 19, 2026

Draper Teams with NEMC to Advance Chip Design and Packaging Services

Draper and the Northeast Microelectronics Coalition (NEMC) have announced a new collaboration under which Draper will provide advisory services to startups and small companies within NEMC’s membership to de-risk and accelerate lab-to-fab technology transitions, with the formal introduction planned for the 2026 Microelectronics Commons Annual Meeting in Washington, D.C. The services extend NEMC’s PROPEL program by offering application-specific integrated circuit design and multi-project wafer readiness advisory support to help members reduce execution risk, improve design quality and better prepare for fabrication and downstream integration.

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“We look forward to sharing our unique experience and deep expertise in ASIC design and MPW preparedness with NEMC members,” said Michael Cassidy, Director, Secured & Assured Systems, Draper. “This agreement reflects our commitment as a trusted innovation partner to strengthen this region’s microelectronics ecosystem by meeting innovators where they are. Draper’s role will be to help NEMC members navigate the complexity of ASIC design, fabrication, and integration so their ideas can move from the lab into the real world to support national security and commercial competitiveness.” Farhad Vazehgoo added, “This unique collaboration with Draper provides microelectronics innovators much-needed access to trusted advisory support within the ME Commons ecosystem, reinforcing the value of design readiness and MPW execution discipline,” and noted that the partnership strengthens support to overcome manufacturing hurdles and accelerate time to market.

Read More: Draper and the Northeast Microelectronics Coalition (NEMC) Announce Chip Design and Packaging

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