Texas Instruments (TI) has revealed brand new isolated power modules that among others are capable of enhancing power density, efficiency, and safety aspects of modern data centers and EVs greatly. TI’s new UCC34141-Q1 and UCC33420 modules are developed based on the company’s exclusive IsoShield technology, which is a multi-chip packaging solution aiming at achieving power density up to three times that of separate traditional solutions.
TI is presenting these developments at the 2026 Applied Power Electronics Conference, which will be held from March 23 to 26 in San Antonio, Texas.
“Packaging innovation is revolutionizing the power industry, with power modules at the forefront of this transformation,” said Kannan Soundarapandian, vice president and general manager, High Voltage Products at TI. “TI’s new IsoShield technology delivers what power engineers need most: smaller solutions with improved efficiency and reliability and a faster time to market. It is the latest example of TI’s continued commitment to advance power semiconductor technology to help solve today’s engineering challenges.”
Advancing Power Density via Innovative Packaging
As electronics become smaller in size and performance demands increase, traditional power design approaches are reaching a point of diminishing returns. Power modules have been widely used to minimize board space and speed design times, but innovations in power package technology are now providing additional benefits in terms of efficiency and scalability.
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TI’s IsoShield technology provides a best-in-class solution by integrating a high-performance planar transformer with an isolated power stage in a compact package. This technology supports multiple levels of isolation: functional, basic, and reinforced, along with distributed power architectures that can help eliminate single-point failures and achieve extremely high functional safety requirements. This technology represents a major breakthrough in power supply design, which can achieve a 70% reduction in size while providing 2W of power.
Enabling Next-Generation Data Center and EV Designs
The demand of higher power density is extremely urgent in the sectors that are changing very quickly, like cloud infrastructure and electric mobility. Since data centers are becoming larger to support AI workloads and digital services, it is necessary for efficient power modules to give more power in smaller and smaller physical spaces.
TIs IsoShield-enabled modules meet this challenge by providing small size power source without any decrease of reliability or safety. So, data center operators can raise performance to the highest level while at the same time they make the best use of space and energy.
In the automotive sector, particularly considering electric vehicles, higher power density almost directly results in lighter systems, longer driving range and better overall efficiency. These power modules help the designers in achieving the desired performance levels while at the same time following the very rigorous safety and reliability standards.
Continuing Leadership in Power Semiconductor Innovation
The addition of IsoShield technology represents another step forward in TI’s ongoing commitment to power management innovation. TI continues to build on its portfolio of power modules with advanced packaging technologies such as integrated transformer and inductor-based modules.
With a portfolio of more than 350 power modules, TI continues to drive scalable, high-performance semiconductor solutions to enable engineers to tackle complex power design challenges.
