QuickLogic Corporation, a pioneer in embedded FPGA (eFPGA) Hard IP, ruggedized FPGAs, and FPGA development tools, announced its participation in the newly launched Intel Foundry Chiplet Alliance. As part of the broader Intel Foundry Accelerator Alliance initiative, this new program brings together industry leaders in chiplet innovation to create a secure, standards-based ecosystem that supports both U.S. Military, Aerospace & Government (USMAG) and high-volume commercial applications.
The Intel Foundry Chiplet Alliance provides members with:
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Early access to Intel Foundry’s advanced packaging technologies, process design kits (PDKs), and technology roadmaps
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Participation in multi-project wafer (MPW) shuttles, reducing development cycles and prototyping costs
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A collaborative forum to shape interoperable chiplet infrastructures using the Universal Chiplet Interconnect Express (UCIe) standard, supporting mission-critical security and reliability standards
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QuickLogic’s involvement in the Chiplet Alliance builds upon its current role in both the Intel Foundry IP and USMAG Alliance programs. The company already delivers customizable eFPGA Hard IP on Intel’s 18A process node. Now, with its Chiplet Alliance membership, QuickLogic expands that collaboration to include packaging-level integration-ensuring its reconfigurable logic solutions can seamlessly interoperate with chiplets from other alliance members within multi-die systems.
“Joining the Intel Foundry Chiplet Alliance is a logical next step for QuickLogic,” said Brian Faith, CEO of QuickLogic. “Early access to Intel Foundry’s advanced processes and packaging technologies will let us bring our customizable eFPGA chiplets to market faster and with lower risk-benefiting customers who need secure, flexible solutions for aerospace, defense, and fast-moving commercial applications.”