Monday, December 23, 2024

Orca Launches ORC5000 Platform for Low-Power ASIC Designs

Satellite 2023  Orca Systems, a fabless semiconductor company delivering groundbreaking digital RF technology, has introduced a highly integrated ASIC platform that significantly improves system performance and reduces power consumption for power-sensitive space, terrestrial, industrial and edge computing applications. Orca’s new ORC5000 ASIC platform has been applied to develop Orca’s first ASIC product, the ORC5990, designed for use in low-Earth orbit (LEO) IoT satellite payload and terrestrial IoT gateway designs. The company’s custom ASIC design, modem expertise and integration capabilities offer 10x performance enhancements over conventional FPGA-based system design with only a fraction of the power consumption.

Orca Systems’ technology assets in the RF, analog, DSP and power management domains serve as building blocks and key elements of the ORC5000 ASIC platform. Orca’s innovative systems architecture and semiconductor design expertise have enabled the company to build custom ASIC and RF SoC solutions that precisely meet customer performance/power/area needs. This high level of specialization, spanning initial system architecture to final production, makes Orca Systems’ ORC5000 platform the clear choice when compared to conventional implementations using FPGA and other discrete components. Orca ASICs are extremely energy efficient by design, making them an optimal solution to meet the stringent energy budgets of power-sensitive applications.

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“Conventional implementations using discrete components or FPGAs are not optimized to meet the application-specific needs of today’s low-power system designs, resulting in higher power consumption and costly overhead and features,” said John McDonough, CEO of Orca Systems. “Orca Systems has the custom ASIC and RF SoC design expertise to address our customers’ performance, power and board area requirements and deliver solutions that significantly reduce total cost of ownership. Our design capabilities also include development and integration of complex RF, analog and digital IP from our partners and customers.”

The ORC5000 ASIC platform based on the GF 22FDX platform has significant advantages for use in LEO satellite payloads due to its low power consumption and low susceptibility to latch-up and single event effects (SEE). The new platform also uses GF’s eMRAM technology in the application CPU subsystem, which enables low power and reduced soft-error rate and improves reliability for satellite communications.

SOURCE: Businesswire

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