Innodisk has announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, marking the first product line within Innodisk’s AI on ARM portfolio and a significant step toward scalable, energy-efficient edge AI deployments. Headlined by the EXMP-Q911 COM-HPC Mini module, the series delivers up to 100 TOPS of AI performance while supporting low power operation, extended temperature reliability from -40°C to 85°C, and long-term availability through 2038 via Qualcomm Dragonwin SoCs. Powered by the Dragonwing™ IQ-9075 processor with an 8-core Kryo Gen 6 CPU and Adreno 663 GPU, the module can achieve up to 10× higher AI inference FPS compared to similar platforms, while integrating 36GB LPDDR5X memory, 128GB UFS 3.1 storage, and broad industrial connectivity.
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Beyond hardware, Innodisk complements the platform with IQ Studio, an open-source developer portal, and its iCAP cloud-based device and AI model management platform to streamline development and deployment. “With Innodisk’s new AI on Dragonwing series, we’re making advanced edge intelligence more accessible and scalable for industrial customers,” stated Anand Venkatesan, Senior Director, Product Management and Head of Industrial Processors, Qualcomm Technologies, Inc. “By pairing Qualcomm Dragonwing™ SoCs with Innodisk’s in‑house software and peripherals, OEMs can accelerate development and deploy with the performance, efficiency, and reliability they need—today and over the long term.”