Texas Instruments (TI) introduced the first purpose-built semiconductors with ultrasonic lens cleaning (ULC) technology, enabling camera systems to quickly detect and remove dirt, ice and water using microscopic vibrations.
Removing contaminants from camera lenses traditionally requires manual cleaning, causing system downtime, or the use of various mechanical parts that could malfunction. TI’s new ULC chipset, including the ULC1001 digital signal processor (DSP) and companion DRV2901 piezo transducer driver, features a proprietary technology that allows cameras to rapidly self-clear contaminants using precisely controlled vibrations to rapidly eliminate debris, which improves system accuracy and reduces maintenance requirements. The chipset offers designers a compact and affordable way to use ULC in a wide range of applications and camera sizes.
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“ULC can make widespread use of self-cleaning cameras and sensors a reality. Existing cleaning approaches are expensive and impractical, requiring complicated mechanics, costly electronics and significant processing to detect contaminants and execute cleaning,” said Avi Yashar, product marketing engineer at TI. “With the recent proliferation of cameras in a variety of applications, from automotive and traffic cameras to smart cities and manufacturing, there’s a strong need for a simple, cost-effective way to enable self-cleaning cameras.”
The ULC1001 controller includes proprietary algorithms for automatic sensing, cleaning, and temperature and fault detection without any image processing, making ULC technology highly adaptable to various camera lens designs. The chipset’s small form factor makes it possible to improve machine vision and sensing in a variety of applications – any place that a camera or sensor could get dirty. To learn how it works, read the technical article, “Ultrasonic Lens Cleaning: A Solid-State Technology You Didn’t Know You Needed.”
SOURCE: PR Newswire