IBM and the University of Dayton are partnering up. They’ll work on developing new tech for semiconductors and come up with new materials. The goal is to boost innovation in some key areas of AI. These fields include advanced AI hardware, new packaging methods, and photonics.
IBM is giving the University of Dayton advanced semiconductor equipment. This will help set up a new nanofabrication facility on campus. This facility will be done in early 2027. It will focus on semiconductor research and development. It will give students and researchers hands-on experience. They can turn lab ideas into real products.
A University of Dayton teacher and an IBM tech expert will team up to boost collaboration. Students and researchers will work together. This gives them direct access to leading experts from academia and industry.
“This is an important moment for the University of Dayton. Deepening our relationship with IBM with this research collaboration will help position UD as a leader in semiconductor and emerging technology research and enable our faculty and students to conduct groundbreaking work,” said Eric F. Spina, President, University of Dayton. “I’m grateful to IBM for their state-of-the-art equipment contributions estimated at over $10M which will position us to educate the next generation of talented engineers trained for the modern economy.”
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“This collaboration continues IBM’s tradition of bringing together industry and academia to fuel innovation,” said James Kavanaugh, Senior Vice President and Chief Financial Officer, IBM. “Students and researchers at the University of Dayton will have exciting opportunities to contribute to the next wave of chip and hardware breakthroughs that are essential for the AI era.”
This new agreement strengthens the partnership between IBM and the University of Dayton. It highlights their teamwork at the University’s Digital Transformation Center. They also share a role in the AI Alliance, which IBM co-founded in 2023.
IBM and the University of Dayton are collaborating to boost semiconductor innovation. They aim to create a skilled talent pipeline. This will support the growth of the U.S. chip industry over time. The collaboration is based in Dayton, Ohio, known for innovation and aviation. It seeks to connect with Wright-Patterson Air Force Base. The goal is to build a new ecosystem for semiconductor research and development.
“This relationship between the University of Dayton and IBM promises to be a game-changer for the Dayton region, particularly in the crucial area of semiconductor workforce development. It’s also an example of the collaboration that defines the Dayton spirit,” said Jeff Hoagland, President and CEO, Dayton Development Coalition. “Looking to the future, we’re excited about the possibilities and positive effects on our community including boosting our tech ecosystem, attracting more businesses, and cementing the Dayton region’s reputation as a premier hub for advanced manufacturing and technology.”