ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced that it has entered a joint development agreement with Silicon Austria Labs (SAL) centered on processes and hardware for advanced packaging. To enable these efforts, SAL has purchased a ClassOne Solstice® S8 single-wafer wet processing system, which it will deploy for a range of applications key to next-generation advanced packaging. The purchase was a competitive win for ClassOne, which plans to ship the system in early Q2 2026.
The SAL Solstice S8 system will be configured with multiple electroplating chambers: two CopperMax™; a Gen4 ECD; a vacuum pre-wet; and a pre-wet/face-up spin rinse dry (SRD). SAL plans to leverage the system for advanced processes including hybrid bonding of ultrafine pitch structures using copper plating (damascene-like process), fan-out wafer-level packaging, thick copper deposition, copper through-silicon vias (TSVs) with high aspect ratios, and magnetic film electroplating.
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“Working with ClassOne will not only help drive our current R&D efforts but will allow us to tap into their plating and wet processing expertise to ideate and develop exciting new packaging processes and solutions,” said Ali Roshiangias, Head of Research Unit, Heterogeneous Integration Technologies (HIT) at SAL. “The Solstice S8’s combination of exceptional process flexibility and compact footprint made it the ideal choice for our advanced packaging R&D initiatives. Its ability to support a wide range of applications will enable us to accelerate innovation while making the most of our cleanroom space.”
“We’re excited to collaborate with Silicon Austria Labs to push the boundaries of advanced packaging,” said Byron Exarcos, CEO of ClassOne Technology. “The Solstice S8 was designed from the ground up to deliver unmatched flexibility in a compact, production-proven platform-capabilities that align perfectly with SAL’s mission to accelerate next-generation process development.”
SOURCE: GlobeNewswire