NHanced recently announced its collaboration with Avalanche Technology to manifest advanced solutions to the warfighter with the right combination of impactful capability and low risk integration. The US Government’s acquisition strategies are evolving rapidly, with increased emphasis on utilizing advanced commercial off-the-shelf (COTS) technology. In alignment with this vision, leveraging Avalanche’s industry-leading Space Grade MRAM as a chiplet in NHanced’s proven 2.5D integration flows creates an optimized (SiP) platform that can generate rapid solutions.
Avalanche Technology presented a vision of High Performance Computing architectures at the 2019 MRAM forum, positioning MRAM to replace various types of legacy memory in support of a variety of SoC and FPGA architectures. This replacement is already a reality for high reliability applications across the A&D ecosystem, revolutionizing SWaP and system adaptability in the process.
Open standard interfaces and reusable building blocks such as advanced Space Grade MRAM chiplets promise to drive further meaningful integration in the industry. Integrating MRAM via heterogeneous 2.5D packaging decouples memory from the rigid constraints of monolithic fabrication. This modular approach streamlines the development flow, significantly lowering R&D overhead and accelerating time-to-market.
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In support of that earlier vision, Avalanche’s first 2.5D MRAM implementation would be the industry- leading Gen 3 Space Grade High-Density Dual QSPI products, known as the gold standard for reliable SoC & FPGA booting today. Data integrity cannot be compromised in space systems; a technology that survives radiation but loses data, wears out over time, delays data commitment, or lacks flight heritage is not truly Space Grade. Partial compliance leads to failure. Avalanche Space Grade MRAM uniquely delivers on all five critical Space Grade criteria: radiation immunity, permanent data retention, unlimited endurance, deterministic nanosecond writes, and proven flight qualification – all without tradeoffs.
When paired with NHanced’s world class hybrid bonding capability, the result is an ideal launchpad for rapid, low risk innovation for the A&D sector. Foremost among today’s 2.5D and 3D integration methods, hybrid bonding delivers optimal SWaP, ruggedness, security, thermal management, latency, and power. Rad-Hard systems can be created with performance and density approaching that of commercial solutions. Hybrid bonding allows seamless integration of advanced and proven building blocks, including high-density MRAM dies, into complex SiP solutions. Development timelines can be slashed from years to months. Other benefits include enhanced radiation tolerance through optimized die stacking, reduced system weight and power for satellite and defense missions, and scalable production that supports rapid iteration on mission-critical designs.
“Our collaboration with Avalanche showcases the power and promise of heterogeneous integration. By using hybrid bonding to stack proven best-of-class chiplets on custom interposers, our US fabs can deliver tailored solutions at a fraction of the time, budget, and risk of monolithic alternatives,” said Bob Patti, President of NHanced Semiconductors. “I foresee rapid customization and waves of innovation for both governmental and commercial applications.”
“Avalanche is thrilled to partner with NHanced to manifest the early vision of MRAM proliferation through heterogeneous integration. As the leader of Space Grade standard memory products for boot, storage, and processing functions in mission critical applications, we are eager to enable low risk rapid variants,” said Paul Chopelas, GM for Space and Defense at Avalanche Technology. “NHanced’s advanced integration capabilities allow us to further extend the SWaP, reliability, radiation resilience, and mission scalability of our flagship MRAM solutions to drive innovation at the SiP level.”
SOURCE: Avalanche
