Alloy Enterprises, a manufacturing company revolutionizing data center cooling with its novel Stack Forging™ process, introduced a new copper direct liquid cooling (DLC) solution. As chip power densities and thermal design power rise-pushing AI server rack power densities beyond 120 kW-traditional cooling methods are reaching their limits.
With Stack Forging, Alloy delivers superior thermal performance with significant advantages:
- Targeted liquid cooling where heat loads are highest
- Up to 10x reduction in pressure drop, enabling smaller pumps and energy savings
- Single-piece construction that eliminates leak points common in traditional liquid cooling systems
“Alloy Enterprises is setting a new standard in direct liquid cooling technology with our proprietary Stack Forging process,” said Ali Forsyth, PhD., CEO and Co-founder of Alloy Enterprises. “We now deliver industry-leading thermal performance in both aluminum and copper, enabling higher rack densities, significant cost savings and greater sustainability. With 600 kW racks on the horizon, the shift to liquid cooling is no longer optional—it’s mission-critical.”
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With the expansion to copper thermal solutions alongside its existing aluminum offerings, Alloy now provides cooling components that meet ASHRAE standards for chemical compatibility while enabling the extreme cooling demands of next-generation high-performance computing and high-density AI workloads.
SOURCE: PRNewswire